Integrated circuits containing transistors and other circuit blocks can be found in packages such as DPAK, or quad flat no-lead (QFN), or small outline transistor in 3-lead, 5-lead, or 6-lead SOT23 packages. Surface mount discretes share standard packages and footprints commonly called 0402, 0603, and 0805. Working from the standard produces compliant footprints from Ball Grid Array (BGA) to wire wound inductors. There are a large variety of components and their footprints standardized by IPC-7351. Working to this standard promotos reliability and quality among fabrication and assembly houses. As such, the Association Connecting Electronics Industries (IPC) developed IPC-7351, the Generic Requirements for Surface Mount Design and Land Pattern Standards. The industry specifies standardized packages along with standardized footprints to support package conformity among vendors. Component packages incorporate anywhere from two conductive leads to hundreds of leads. Diverse arrays of electrical component packages and their associated footprints exist on the market today. Footprints describe the conductive interfaces where electrical components mate with the PCB.
Part of circuit board design is creation of component footprints.
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